FAILURE ANALYSIS IS A CORE COMPETENCY
it metals, polymers, ceramics, circuit boards or microcircuits;
we have the skills base and equipment to provide root cause analysis
with materials and process recommendations to prevent further problems
from occurring. Failure analysis investigations have ranged from
fractured fasteners to failed motherboards.
An SEM image at approximately 800x of a fatigue fracture
surface in a 2024 Aluminum aircraft part.
aspects of a failure are investigated. This includes not only classifying
the failure mode but also determining its cause from an engineering
mechanics and design point of view. We pinpoint the root cause,
be it abuse in service or a processing defect.
We may start by determining conformance to specification and
print requirements regarding material chemical make-up, heat
treatment or refinement, surface treatments, bulk hardness,
etc. We look at both the materials used and application and
emphasize design, maintenance and/or material Changes that
would improve performance. We meld our FA expertise with our
Testing Know-how to help you design tests that can screen-out
defective units and improve product reliability.
AMI or Acoustic Micro-Imaging is used to look at the die
attach of this semiconductor device. The white areas are voids.